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  Image provided by Sony
  Sony CMOS Sensor Diagram. Component could be used in iPhone 5.

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The upcoming iPhone is rumored to be thinner than its predecessor which will mean it will need to incorporate smaller parts in order to function at an optimum level.

The current selection of camera modules for smartphones have not been shrinking as rapidly as other parts so it will be difficult for Apple to deliver a quality shooter inside its next-gen device.

However, Sony is working on something that could easily solve that issue. The electronics giant is producing a CMOS image sensor that could be a great fit for a thinner iPhone.

"This image sensor layers the pixel section containing formations of back-illuminated structure pixels onto chips containing the circuit section for signal processing, which is in place of supporting substrates for conventional back-illuminated CMOS image sensors," explained the company. "This structure achieves further enhancement in image quality, superior functionalities and a more company size that will lead to enhanced camera evolution."

By making it more compact, Sony might have created the perfect component for Apple's upcoming device. However, there is no official confirmation on whether or not the Cupertino-based company will employ Sony to create the next iPhone's camera.

Apple could strongly benefit from using Sony's technology since the Japanese company is creating a product that is compact, plus its manufacturing process is cheaper and the image quality will be better.

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This camera module is also expected to be faster, consume less power and sport higher pixel numbers.

"In theory, the imaging circuitry being separate of the sensors could give Apple greater control over the camera system and help increase its functionality by leveraging the company's in-house designed A-series chip," 9to5Mac said.

Sony will begin to ship the 8-megapixel model in March followed by a 13-megapixel model in June. The current 8-megapixel sensor in the iPhone 4S is reportedly produced by Sony.