The iPhone 6 will feature a new fingerprint sensor that is more efficient than the version found on the iPhone 5s.
TSMC will handle the manufacturing of this new component which will officially begin in the second quarter of this year, according to a recent report from DigiTimes. The company will be shifting to a larger 12-inch fab from the current 8-inch fab which is expected to increase the product's efficiency.
TSMC will also be handling the packaging process for the sensors rather than contracting it out to another company.
The Touch ID fingerprint sensor on the iPhone 5s was said to be one of the primary factors that lead to tight supplies of the device early on. Low yields from packaging companies such as Xintec slowed down Apple's ability to get the product into consumer's hands.
The iPhone 6 is also rumored to feature an 8-megapixel camera with improved image stabilization.
A previous report from The China Post confirmed that Apple will not be upgrading the resolution of the rear camera for the iPhone 6. It cites analysts from Nomura Securities for the information.
"According to Nomura Securities, Largan's recently lagging performance in the market is caused by rumors that Apple may adopt an 8-megapixel camera with improved optical image stabilization on its upcoming handset, instead of the 16MP upgrade anticipated by industry observers," wrote the site.
Apple is choosing to go with the same megapixels in order to give the device a more portable form factor, according to the source. Largan might be employed for the task of creating the new camera as the company is capable of coping with the complexity of the camera module, according to Nomura Securities.
The iPhone 6 is rumored to be released in the fall of 2014.