Huawei Ascend P8 Release Date, Leaked Specs: Arriving With Aluminum Frame?
The rumors about the Huawei Ascend P8 have been making rounds in the tech news for a while already. First, there was a talk about the next device to don the company's signature thin body design built around a metal chassis. Additional rumors indicated that the next flagship from the Honor 6 Plus maker will feature a 5.2" 1080p display and will run on the HiSilicon Kirin 930 chipset which is built on TSMC's 16nm process.
Recent news pointed out to what seemed to be a new info about the Huawei Ascend P8. According to a report from GSMArena.com, the upcoming device will have an aluminum frame.
The leaked pictures, which were posted by Nowhereelse.fr showcased a super thin metallic chassis. Its exact measurement is not known yet. However, judging from the carved holes, the camera for the Ascend P7 successor will likely to have a single-LED flash. The phone itself will come with two slot trays.
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The first tray appears to be a holder for the primary SIM while the other one is either for a secondary SIM or for a microSD memory card.
Pocketnow.com meanwhile wrote that the image may not directly suggest what the other parts of the device would be made of.
"We're not sure if this means that this device will be made entirely of aluminum, or if Huawei will continue to experiment with glass, ceramic or sapphire as we saw this year," the site stated.
With the given stiff level of competition against other tech giants like Samsung, Apple and Xiaomi, the Taiwan-based firm will surely come off with a big surprise for its fans.
Reports already indicated that the Huawei Ascend P8 is expected to be announced in January on CES in Las Vegas or at the MWC expo in early March in Barcelona.
